Micro - Dicyandiamide

Chemical Formula: C2H4N4
Molecular Weight: 84.08
CAS No. 461-58-5

Material Safety Data Sheet (Dicyandiamide)
Product Description

Usage:
1). One component adhesives.
2). Epoxy powder coatings.
3). Prepregs and film adhesives.
4). Electronic potting and encapsulating compounds.
 
Appearance: Free flowing white powder.
 
Specification:
 
Specification
Superfine Grade
Purity ％≥
97.5
Moisture %≤
0.10
Particle size(98%)(µm)
10
Equivalent WT/[H]
21
Recommended use level(phr. EEW=190)
4-15
Heat distortion temperature(°C)
125